Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 651 |
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 666 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 1,321 |
| 179 | 2022 COSD(Co-operating Organization for Standards Development) Workshop | 관리자 | 2022-07-25 | 631 |
| 178 | 2022-1 IEC TC91 International Standard Meeting | 관리자 | 2022-07-19 | 1,199 |
| 177 | [KPIA Seminar] 'Packaging is a key factor in determining semiconductor competiti... | 관리자 | 2022-07-19 | 1,370 |
| 176 | [KPIA Seminar] Samsung which focuses on semiconductor packaging said, 'WLP will ... | 관리자 | 2022-07-19 | 1,429 |
| 175 | [EMK 2022] Korea Electronics Manufacturing Industry Exhibition 2022 | 관리자 | 2022-07-19 | 653 |
| 174 | [KPIA Summer Seminar] Semiconductor Packaging Integration and Materials Technolo... | 관리자 | 2022-07-19 | 1,638 |
| 173 | [KPIA Summer Seminar] Semiconductor Packaging Integration Technology Seminar | 관리자 | 2022-07-19 | 1,514 |
-
관리자 2022-09-01 Hit 651
-
관리자 2022-08-30 Hit 666
-
관리자 2022-08-10 Hit 1,321
-
관리자 2022-07-25 Hit 631
-
관리자 2022-07-19 Hit 1,199
-
관리자 2022-07-19 Hit 1,370
-
관리자 2022-07-19 Hit 1,429
-
관리자 2022-07-19 Hit 653
-
관리자 2022-07-19 Hit 1,638
-
관리자 2022-07-19 Hit 1,514