Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 109 | MOU with Reed K. Fairs | 관리자 | 2021-09-13 | 278 |
| 108 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 514 |
| 107 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 579 |
| 106 | Intelligent semiconductor technology seminar | 관리자 | 2021-09-13 | 606 |
| 105 | Semiconductor technology seminar | 관리자 | 2021-09-13 | 620 |
| 104 | Electronic mounting technology standard seminar | 관리자 | 2021-09-13 | 567 |
| 103 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 487 |
| 102 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 517 |
| 101 | Semiconductor Packaging Integration technology equipment development meeting | 관리자 | 2021-09-13 | 470 |
| 100 | MOU with SANICO Co., Ltd. | 관리자 | 2021-09-13 | 260 |
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관리자 2021-09-13 Hit 278
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관리자 2021-09-13 Hit 514
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관리자 2021-09-13 Hit 579
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관리자 2021-09-13 Hit 606
-
관리자 2021-09-13 Hit 620
-
관리자 2021-09-13 Hit 567
-
관리자 2021-09-13 Hit 487
-
관리자 2021-09-13 Hit 517
-
관리자 2021-09-13 Hit 470
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관리자 2021-09-13 Hit 260