Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 1,251 |
| 191 | [Advanced Packaging Symposium] Semiconductor Advanced Packaging Technology Sympo... | 관리자 | 2022-11-07 | 1,611 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 1,379 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 696 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 1,327 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 649 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 1,282 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 1,539 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 659 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 648 |
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관리자 2022-11-16 Hit 1,251
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관리자 2022-11-07 Hit 1,611
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관리자 2022-11-01 Hit 1,379
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관리자 2022-10-28 Hit 696
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관리자 2022-10-26 Hit 1,327
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관리자 2022-10-26 Hit 649
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관리자 2022-10-24 Hit 1,282
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관리자 2022-10-19 Hit 1,539
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관리자 2022-10-06 Hit 659
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관리자 2022-09-26 Hit 648