Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 142 | MOU with JPCA | 관리자 | 2021-11-15 | 416 |
| 141 | Advanced Packaging Integration Technology international symposium ('21.11/09-10) | 관리자 | 2021-11-15 | 1,375 |
| 140 | [Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting T... | 관리자 | 2021-10-29 | 1,047 |
| 139 | MOU with Yole | 관리자 | 2021-10-13 | 425 |
| 138 | MOU with Hanbat University | 관리자 | 2021-09-27 | 414 |
| 137 | MOU with KSCM | 관리자 | 2021-09-27 | 418 |
| 136 | Semiconductor Packaging Integration Technology Seminar | 관리자 | 2021-09-15 | 973 |
| 135 | Electronics technology standard seminar | 관리자 | 2021-09-15 | 929 |
| 134 | MOU with KSCM | 관리자 | 2021-09-13 | 413 |
| 133 | IEC TC91 Professional Committee – Zoom | 관리자 | 2021-09-13 | 1,774 |
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관리자 2021-11-15 Hit 416
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관리자 2021-11-15 Hit 1,375
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관리자 2021-10-29 Hit 1,047
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관리자 2021-10-13 Hit 425
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관리자 2021-09-27 Hit 414
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관리자 2021-09-27 Hit 418
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관리자 2021-09-15 Hit 973
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관리자 2021-09-15 Hit 929
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관리자 2021-09-13 Hit 413
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관리자 2021-09-13 Hit 1,774