Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 131 | MOU with LEO | 관리자 | 2021-09-13 | 380 |
| 130 | Symposium Packaging Integration | 관리자 | 2021-09-13 | 838 |
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 421 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 368 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 836 |
| 126 | Material parts development business KICK-OFF workshop | 관리자 | 2021-09-13 | 381 |
| 125 | MOU with HAESUNG DS | 관리자 | 2021-09-13 | 394 |
| 124 | MOU with me |
관리자 | 2021-09-13 | 370 |
| 123 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 764 |
| 122 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 800 |
-
관리자 2021-09-13 Hit 380
-
관리자 2021-09-13 Hit 838
-
관리자 2021-09-13 Hit 421
-
관리자 2021-09-13 Hit 368
-
관리자 2021-09-13 Hit 836
-
관리자 2021-09-13 Hit 381
-
관리자 2021-09-13 Hit 394
-
관리자 2021-09-13 Hit 370
-
관리자 2021-09-13 Hit 764
-
관리자 2021-09-13 Hit 800