Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 571 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 1,108 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 521 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 1,043 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 1,283 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 545 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 519 |
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 528 |
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 520 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 1,088 |
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관리자 2022-10-28 Hit 571
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관리자 2022-10-26 Hit 1,108
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관리자 2022-10-26 Hit 521
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관리자 2022-10-24 Hit 1,043
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관리자 2022-10-19 Hit 1,283
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관리자 2022-10-06 Hit 545
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관리자 2022-09-26 Hit 519
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관리자 2022-09-01 Hit 528
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관리자 2022-08-30 Hit 520
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관리자 2022-08-10 Hit 1,088