Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 141 | Advanced Packaging Integration Technology international symposium ('21.11/09-10) | 관리자 | 2021-11-15 | 1,063 |
| 140 | [Mounting Technology Seminar] 5G&6G Communication Parts and Materials Mounting T... | 관리자 | 2021-10-29 | 865 |
| 139 | MOU with Yole | 관리자 | 2021-10-13 | 330 |
| 138 | MOU with Hanbat University | 관리자 | 2021-09-27 | 322 |
| 137 | MOU with KSCM | 관리자 | 2021-09-27 | 328 |
| 136 | Semiconductor Packaging Integration Technology Seminar | 관리자 | 2021-09-15 | 783 |
| 135 | Electronics technology standard seminar | 관리자 | 2021-09-15 | 740 |
| 134 | MOU with KSCM | 관리자 | 2021-09-13 | 320 |
| 133 | IEC TC91 Professional Committee – Zoom | 관리자 | 2021-09-13 | 1,590 |
| 132 | MOU with skydiamond | 관리자 | 2021-09-13 | 339 |
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관리자 2021-11-15 Hit 1,063
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관리자 2021-10-29 Hit 865
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관리자 2021-10-13 Hit 330
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관리자 2021-09-27 Hit 322
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관리자 2021-09-27 Hit 328
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관리자 2021-09-15 Hit 783
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관리자 2021-09-15 Hit 740
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관리자 2021-09-13 Hit 320
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관리자 2021-09-13 Hit 1,590
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관리자 2021-09-13 Hit 339