Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 129 | Inter-ministerial KICK-OFF workshop for materials and parts development business | 관리자 | 2021-09-13 | 290 |
| 128 | JDA with IMAGIS, NOVASEMI, ATK | 관리자 | 2021-09-13 | 251 |
| 127 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 615 |
| 126 | Material parts development business KICK-OFF workshop | 관리자 | 2021-09-13 | 271 |
| 125 | MOU with HAESUNG DS | 관리자 | 2021-09-13 | 277 |
| 124 | MOU with me |
관리자 | 2021-09-13 | 259 |
| 123 | Intelligent Semiconductor Packaging Integration Technology Conference | 관리자 | 2021-09-13 | 538 |
| 122 | IEC TC91 Professional Committee | 관리자 | 2021-09-13 | 546 |
| 121 | Semiconductor technology seminar | 관리자 | 2021-09-13 | 572 |
| 120 | Chungbuk Semiconductor Industry Council | 관리자 | 2021-09-13 | 525 |
-
관리자 2021-09-13 Hit 290
-
관리자 2021-09-13 Hit 251
-
관리자 2021-09-13 Hit 615
-
관리자 2021-09-13 Hit 271
-
관리자 2021-09-13 Hit 277
-
관리자 2021-09-13 Hit 259
-
관리자 2021-09-13 Hit 538
-
관리자 2021-09-13 Hit 546
-
관리자 2021-09-13 Hit 572
-
관리자 2021-09-13 Hit 525