Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 194 | R&D Workshop for material parts development project | 관리자 | 2022-12-23 | 628 |
| 193 | 2022 COSD Project Results | 관리자 | 2022-12-22 | 630 |
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 1,201 |
| 191 | [Advanced Packaging Symposium] Semiconductor Advanced Packaging Technology Sympo... | 관리자 | 2022-11-07 | 1,549 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 1,317 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 672 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 1,281 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 622 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 1,233 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 1,473 |
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관리자 2022-12-23 Hit 628
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관리자 2022-12-22 Hit 630
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관리자 2022-11-16 Hit 1,201
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관리자 2022-11-07 Hit 1,549
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관리자 2022-11-01 Hit 1,317
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관리자 2022-10-28 Hit 672
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관리자 2022-10-26 Hit 1,281
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관리자 2022-10-26 Hit 622
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관리자 2022-10-24 Hit 1,233
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관리자 2022-10-19 Hit 1,473