Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 204 | MOU with JOONGWOO TECHNOLOGY | 관리자 | 2023-05-09 | 687 |
| 203 | R&D workshop for material parts development project | 관리자 | 2023-04-24 | 1,406 |
| 202 | IEC TC91 de facto standard(IPC) forum experts meeting | 관리자 | 2023-04-17 | 1,329 |
| 201 | IEC TC91 Experts Meeting | 관리자 | 2023-04-17 | 1,307 |
| 200 | Korea Electronics Manufacturing Exhibition, EMK 2023 | 관리자 | 2023-04-17 | 4,901 |
| 199 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar II | 관리자 | 2023-04-17 | 1,488 |
| 198 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar I] | 관리자 | 2023-04-17 | 1,566 |
| 197 | IEC TC91 De facto Standard (IPC) Forum Steering Committee | 관리자 | 2023-04-06 | 1,293 |
| 196 | MOTIE R&D project KICK-OFF workshop for material development | 관리자 | 2023-02-24 | 667 |
| 195 | em |
관리자 | 2023-01-19 | 1,953 |
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관리자 2023-05-09 Hit 687
-
관리자 2023-04-24 Hit 1,406
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관리자 2023-04-17 Hit 1,329
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관리자 2023-04-17 Hit 1,307
-
관리자 2023-04-17 Hit 4,901
-
관리자 2023-04-17 Hit 1,488
-
관리자 2023-04-17 Hit 1,566
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관리자 2023-04-06 Hit 1,293
-
관리자 2023-02-24 Hit 667
-
관리자 2023-01-19 Hit 1,953