Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 199 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar II | 관리자 | 2023-04-17 | 1,318 |
| 198 | [KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar I] | 관리자 | 2023-04-17 | 1,396 |
| 197 | IEC TC91 De facto Standard (IPC) Forum Steering Committee | 관리자 | 2023-04-06 | 1,103 |
| 196 | MOTIE R&D project KICK-OFF workshop for material development | 관리자 | 2023-02-24 | 591 |
| 195 | em |
관리자 | 2023-01-19 | 1,326 |
| 194 | R&D Workshop for material parts development project | 관리자 | 2022-12-23 | 531 |
| 193 | 2022 COSD Project Results | 관리자 | 2022-12-22 | 537 |
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 1,009 |
| 191 | [Advanced Packaging Symposium] Semiconductor Advanced Packaging Technology Sympo... | 관리자 | 2022-11-07 | 1,313 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 1,130 |
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관리자 2023-04-17 Hit 1,318
-
관리자 2023-04-17 Hit 1,396
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관리자 2023-04-06 Hit 1,103
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관리자 2023-02-24 Hit 591
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관리자 2023-01-19 Hit 1,326
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관리자 2022-12-23 Hit 531
-
관리자 2022-12-22 Hit 537
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관리자 2022-11-16 Hit 1,009
-
관리자 2022-11-07 Hit 1,313
-
관리자 2022-11-01 Hit 1,130