Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 162 | Semiconductor fusion component mounting technology exchange meeting and integrat... | 관리자 | 2022-05-23 | 409 |
| 161 | IPC SummerCom 2022 | 관리자 | 2022-05-23 | 843 |
| 160 | JIC CONFERENCE 2022_SPRING | 관리자 | 2022-05-18 | 785 |
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 369 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 393 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 769 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 758 |
| 155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 920 |
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 951 |
| 153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 965 |
-
관리자 2022-05-23 Hit 409
-
관리자 2022-05-23 Hit 843
-
관리자 2022-05-18 Hit 785
-
관리자 2022-05-10 Hit 369
-
관리자 2022-04-25 Hit 393
-
관리자 2022-04-20 Hit 769
-
관리자 2022-04-19 Hit 758
-
관리자 2022-04-18 Hit 920
-
관리자 2022-04-18 Hit 951
-
관리자 2022-04-18 Hit 965