Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 161 | IPC SummerCom 2022 | 관리자 | 2022-05-23 | 661 |
| 160 | JIC CONFERENCE 2022_SPRING | 관리자 | 2022-05-18 | 605 |
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 279 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 300 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 571 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 571 |
| 155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 732 |
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 764 |
| 153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 670 |
| 152 | KICK-OFF workshop for materials and parts development business | 관리자 | 2022-03-23 | 304 |
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관리자 2022-05-23 Hit 661
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관리자 2022-05-18 Hit 605
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관리자 2022-05-10 Hit 279
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관리자 2022-04-25 Hit 300
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관리자 2022-04-20 Hit 571
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관리자 2022-04-19 Hit 571
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관리자 2022-04-18 Hit 732
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관리자 2022-04-18 Hit 764
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관리자 2022-04-18 Hit 670
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관리자 2022-03-23 Hit 304