Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 804 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 666 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 1,545 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 644 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 1,593 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 1,564 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 1,334 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 1,441 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 720 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,903 |
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관리자 2023-08-31 Hit 804
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관리자 2023-08-29 Hit 666
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관리자 2023-08-28 Hit 1,545
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관리자 2023-08-16 Hit 644
-
관리자 2023-07-28 Hit 1,593
-
관리자 2023-07-28 Hit 1,564
-
관리자 2023-07-27 Hit 1,334
-
관리자 2023-07-27 Hit 1,441
-
관리자 2023-07-25 Hit 720
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관리자 2023-07-24 Hit 1,903