No | Title | Name | Registration Date | Hit |
---|---|---|---|---|
172 | [KPIA Symposium] Semiconductor Packaging Integration Technology Symposium | 관리자 | 2022-06-28 | 1,075 |
171 | Electronic Manufacturing (IPC) Substantial Standards Forum Steering Committee | 관리자 | 2022-06-21 | 799 |
170 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-06-21 | 797 |
169 | Appointment of R&D standard li |
관리자 | 2022-06-16 | 386 |
168 | MOU with IPC | 관리자 | 2022-06-14 | 399 |
167 | 2nd workshop between ministries for the development of materials and parts | 관리자 | 2022-06-10 | 433 |
166 | MOU with CHUNGBUK HEALTH & SCIENCE UNIVERSITY | 관리자 | 2022-06-02 | 397 |
165 | MOU with KOREA POLYTECHNICS | 관리자 | 2022-05-31 | 426 |
164 | MOU with Chungbuk Provincial University | 관리자 | 2022-05-27 | 393 |
163 | MOU with FAR EAST UNIVERSITY | 관리자 | 2022-05-23 | 392 |