Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 161 | IPC SummerCom 2022 | 관리자 | 2022-05-23 | 802 |
| 160 | JIC CONFERENCE 2022_SPRING | 관리자 | 2022-05-18 | 745 |
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 348 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 371 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 721 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 713 |
| 155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 875 |
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 907 |
| 153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 913 |
| 152 | KICK-OFF workshop for materials and parts development business | 관리자 | 2022-03-23 | 376 |
-
관리자 2022-05-23 Hit 802
-
관리자 2022-05-18 Hit 745
-
관리자 2022-05-10 Hit 348
-
관리자 2022-04-25 Hit 371
-
관리자 2022-04-20 Hit 721
-
관리자 2022-04-19 Hit 713
-
관리자 2022-04-18 Hit 875
-
관리자 2022-04-18 Hit 907
-
관리자 2022-04-18 Hit 913
-
관리자 2022-03-23 Hit 376