Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 695 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,849 |
| 212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 1,454 |
| 211 | MOU with OXWIRES | 관리자 | 2023-07-24 | 690 |
| 210 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 1,336 |
| 209 | Semiconductor Convergence Sensor and Certificate Authority Networking Workshop | 관리자 | 2023-07-03 | 1,067 |
| 208 | Participated in the booth at the Summer Conference of the Korean Institute of El... | 관리자 | 2023-06-26 | 672 |
| 207 | ['23.6.21-22] Symposium on electronic mounting materials | 관리자 | 2023-06-26 | 1,937 |
| 206 | KICK-OFF workshop of the Ministry of Trade, Industry and Energy for the developm... | 관리자 | 2023-06-26 | 1,213 |
| 205 | JPCA SHOW 2023 Exhibition and Events | 관리자 | 2023-06-07 | 667 |
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관리자 2023-07-25 Hit 695
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관리자 2023-07-24 Hit 1,849
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관리자 2023-07-24 Hit 1,454
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관리자 2023-07-24 Hit 690
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관리자 2023-07-19 Hit 1,336
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관리자 2023-07-03 Hit 1,067
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관리자 2023-06-26 Hit 672
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관리자 2023-06-26 Hit 1,937
-
관리자 2023-06-26 Hit 1,213
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관리자 2023-06-07 Hit 667