Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 398 |
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 375 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 778 |
| 179 | 2022 COSD(Co-operating Organization for Standards Development) Workshop | 관리자 | 2022-07-25 | 386 |
| 178 | 2022-1 IEC TC91 International Standard Meeting | 관리자 | 2022-07-19 | 722 |
| 177 | [KPIA Seminar] 'Packaging is a key factor in determining semiconductor competiti... | 관리자 | 2022-07-19 | 822 |
| 176 | [KPIA Seminar] Samsung which focuses on semiconductor packaging said, 'WLP will ... | 관리자 | 2022-07-19 | 869 |
| 175 | [EMK 2022] Korea Electronics Manufacturing Industry Exhibition 2022 | 관리자 | 2022-07-19 | 398 |
| 174 | [KPIA Summer Seminar] Semiconductor Packaging Integration and Materials Technolo... | 관리자 | 2022-07-19 | 1,060 |
| 173 | [KPIA Summer Seminar] Semiconductor Packaging Integration Technology Seminar | 관리자 | 2022-07-19 | 877 |
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관리자 2022-09-01 Hit 398
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관리자 2022-08-30 Hit 375
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관리자 2022-08-10 Hit 778
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관리자 2022-07-25 Hit 386
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관리자 2022-07-19 Hit 722
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관리자 2022-07-19 Hit 822
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관리자 2022-07-19 Hit 869
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관리자 2022-07-19 Hit 398
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관리자 2022-07-19 Hit 1,060
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관리자 2022-07-19 Hit 877