Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 224 | MOU with MK Chem and Tech | 관리자 | 2023-09-07 | 695 |
| 223 | MOU with TLB | 관리자 | 2023-09-05 | 705 |
| 222 | ASPS 2023, Advanced Semiconductor Packaging Show 2023 | 관리자 | 2023-08-31 | 758 |
| 221 | MOU with CMP | 관리자 | 2023-08-29 | 638 |
| 220 | R&D project workshop for High-speed board materials | 관리자 | 2023-08-28 | 1,484 |
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 621 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 1,541 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 1,511 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 1,277 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 1,390 |
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관리자 2023-09-07 Hit 695
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관리자 2023-09-05 Hit 705
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관리자 2023-08-31 Hit 758
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관리자 2023-08-29 Hit 638
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관리자 2023-08-28 Hit 1,484
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관리자 2023-08-16 Hit 621
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관리자 2023-07-28 Hit 1,541
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관리자 2023-07-28 Hit 1,511
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관리자 2023-07-27 Hit 1,277
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관리자 2023-07-27 Hit 1,390