Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 219 | MOU with EXPORUM | 관리자 | 2023-08-16 | 546 |
| 218 | Electronics packaging integration technology and market seminar | 관리자 | 2023-07-28 | 1,322 |
| 217 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2023-07-28 | 1,344 |
| 216 | LAB (Laser Assisted Bonding) Technical Committee | 관리자 | 2023-07-27 | 1,134 |
| 215 | Experts and steering committee joint meeting for IPC forum | 관리자 | 2023-07-27 | 1,187 |
| 214 | MOU with J-EXPO | 관리자 | 2023-07-25 | 597 |
| 213 | Advanced Electronics packaging integration Technology and Market Seminar II | 관리자 | 2023-07-24 | 1,647 |
| 212 | Advanced Electronics packaging integration Technology and Market Seminar I | 관리자 | 2023-07-24 | 1,244 |
| 211 | MOU with OXWIRES | 관리자 | 2023-07-24 | 588 |
| 210 | 2023-1 IEC TC91 International Standard Meeting | 관리자 | 2023-07-19 | 1,152 |
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관리자 2023-08-16 Hit 546
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관리자 2023-07-28 Hit 1,322
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관리자 2023-07-28 Hit 1,344
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관리자 2023-07-27 Hit 1,134
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관리자 2023-07-27 Hit 1,187
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관리자 2023-07-25 Hit 597
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관리자 2023-07-24 Hit 1,647
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관리자 2023-07-24 Hit 1,244
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관리자 2023-07-24 Hit 588
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관리자 2023-07-19 Hit 1,152