Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 159 | MOU with IPITECH | 관리자 | 2022-05-10 | 237 |
| 158 | MOU with KOPEA | 관리자 | 2022-04-25 | 250 |
| 157 | Packaging integration industry de facto standard(IPC) forum Kick-off ceremony | 관리자 | 2022-04-20 | 480 |
| 156 | IEC TC91 (Electronics Assembly Technology) Expert Committee | 관리자 | 2022-04-19 | 478 |
| 155 | [Packaging Integration technology seminar] Major technology issue and standard t... | 관리자 | 2022-04-18 | 628 |
| 154 | [Packaging Integration technology seminar] High-speed Substrate material technol... | 관리자 | 2022-04-18 | 651 |
| 153 | [Packaging Integration Technology Seminar] Semiconductor Packaging Integration T... | 관리자 | 2022-04-18 | 576 |
| 152 | KICK-OFF workshop for materials and parts development business | 관리자 | 2022-03-23 | 266 |
| 151 | Ministry of Trade, Industry and Energy Technology Exchange Meeting | 관리자 | 2022-02-10 | 547 |
| 150 | International em |
관리자 | 2022-01-19 | 746 |
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관리자 2022-05-10 Hit 237
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관리자 2022-04-25 Hit 250
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관리자 2022-04-20 Hit 480
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관리자 2022-04-19 Hit 478
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관리자 2022-04-18 Hit 628
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관리자 2022-04-18 Hit 651
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관리자 2022-04-18 Hit 576
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관리자 2022-03-23 Hit 266
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관리자 2022-02-10 Hit 547
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관리자 2022-01-19 Hit 746