Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 242 | em |
관리자 | 2024-01-16 | 861 |
| 241 | MOU with KTC(Korea Testing Certification Institute) | 관리자 | 2023-12-19 | 748 |
| 240 | MOU with IEEC(Integrated Electronics Engineering Center) | 관리자 | 2023-12-18 | 641 |
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 627 |
| 238 | R&D Workshop on Substrate Material Technology Development Project for High-Speed... | 관리자 | 2023-11-20 | 1,377 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 720 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 2,555 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 1,419 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 637 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 704 |
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관리자 2024-01-16 Hit 861
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관리자 2023-12-19 Hit 748
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관리자 2023-12-18 Hit 641
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관리자 2023-11-22 Hit 627
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관리자 2023-11-20 Hit 1,377
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관리자 2023-11-13 Hit 720
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관리자 2023-11-10 Hit 2,555
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관리자 2023-11-10 Hit 1,419
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관리자 2023-11-10 Hit 637
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관리자 2023-11-08 Hit 704