Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 181 | JPCA SHOW 2022 REPORT | 관리자 | 2022-08-30 | 283 |
| 180 | international standardization forum operation mid-term meeting | 관리자 | 2022-08-10 | 587 |
| 179 | 2022 COSD(Co-operating Organization for Standards Development) Workshop | 관리자 | 2022-07-25 | 295 |
| 178 | 2022-1 IEC TC91 International Standard Meeting | 관리자 | 2022-07-19 | 534 |
| 177 | [KPIA Seminar] 'Packaging is a key factor in determining semiconductor competiti... | 관리자 | 2022-07-19 | 642 |
| 176 | [KPIA Seminar] Samsung which focuses on semiconductor packaging said, 'WLP will ... | 관리자 | 2022-07-19 | 686 |
| 175 | [EMK 2022] Korea Electronics Manufacturing Industry Exhibition 2022 | 관리자 | 2022-07-19 | 306 |
| 174 | [KPIA Summer Seminar] Semiconductor Packaging Integration and Materials Technolo... | 관리자 | 2022-07-19 | 864 |
| 173 | [KPIA Summer Seminar] Semiconductor Packaging Integration Technology Seminar | 관리자 | 2022-07-19 | 654 |
| 172 | [KPIA Symposium] Semiconductor Packaging Integration Technology Symposium | 관리자 | 2022-06-28 | 862 |
-
관리자 2022-08-30 Hit 283
-
관리자 2022-08-10 Hit 587
-
관리자 2022-07-25 Hit 295
-
관리자 2022-07-19 Hit 534
-
관리자 2022-07-19 Hit 642
-
관리자 2022-07-19 Hit 686
-
관리자 2022-07-19 Hit 306
-
관리자 2022-07-19 Hit 864
-
관리자 2022-07-19 Hit 654
-
관리자 2022-06-28 Hit 862