Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 192 | 2022-2 IEC TC91 International Standard Meeting | 관리자 | 2022-11-16 | 729 |
| 191 | [Mounting Technology Symposium] Semiconductor Convergence Components Mounting Te... | 관리자 | 2022-11-07 | 1,013 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 830 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 431 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 812 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 378 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 784 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 984 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 412 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 376 |
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관리자 2022-11-16 Hit 729
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관리자 2022-11-07 Hit 1,013
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관리자 2022-11-01 Hit 830
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관리자 2022-10-28 Hit 431
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관리자 2022-10-26 Hit 812
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관리자 2022-10-26 Hit 378
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관리자 2022-10-24 Hit 784
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관리자 2022-10-19 Hit 984
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관리자 2022-10-06 Hit 412
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관리자 2022-09-26 Hit 376