Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 252 | KPIA technology and market seminar I | 관리자 | 2024-04-29 | 1,680 |
| 251 | R&D Workshop on Substrate Material Technology Development Project for High-Speed | 관리자 | 2024-03-27 | 1,524 |
| 250 | Korea-Japan Experts Meeting for Advanced Packaging Integration R&D Meeting | 관리자 | 2024-02-29 | 1,523 |
| 249 | MOU, KPIA-RC3DS | 관리자 | 2024-02-29 | 705 |
| 248 | 2024 SMART SMT&PCB ASSEMBLY | 관리자 | 2024-02-26 | 621 |
| 247 | Materials and Parts Development Business Ministry of Trade, Industry and Energy ... | 관리자 | 2024-02-26 | 1,357 |
| 246 | Advanced electronic packaging technology and market seminar | 관리자 | 2024-02-26 | 2,615 |
| 245 | Technology market and standard trend seminar by electrical, electronic, and info... | 관리자 | 2024-02-26 | 1,587 |
| 244 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 1,356 |
| 243 | MOU with ULSAN COLLEGE | 관리자 | 2024-01-30 | 576 |
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관리자 2024-04-29 Hit 1,680
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관리자 2024-03-27 Hit 1,524
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관리자 2024-02-29 Hit 1,523
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관리자 2024-02-29 Hit 705
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관리자 2024-02-26 Hit 621
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관리자 2024-02-26 Hit 1,357
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관리자 2024-02-26 Hit 2,615
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관리자 2024-02-26 Hit 1,587
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관리자 2024-02-21 Hit 1,356
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관리자 2024-01-30 Hit 576