Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 191 | [Mounting Technology Symposium] Semiconductor Convergence Components Mounting Te... | 관리자 | 2022-11-07 | 831 |
| 190 | IEC TC91 (Electronic Assembly Technology) Expert Committee | 관리자 | 2022-11-01 | 643 |
| 189 | PCB Materials' technology for high speed communication | 관리자 | 2022-10-28 | 336 |
| 188 | 2022 Semiconductor Experts Forum | 관리자 | 2022-10-26 | 630 |
| 187 | MOU with EV Advanced Materials | 관리자 | 2022-10-26 | 282 |
| 186 | Semiconductor packaging integration De facto standard(IPC) Forum experts meeting... | 관리자 | 2022-10-24 | 591 |
| 185 | JPCA-KPIA Semiconductor packaging integration seminar | 관리자 | 2022-10-19 | 801 |
| 184 | MOU with BKelectron | 관리자 | 2022-10-06 | 314 |
| 183 | National Defense Quality Conference | 관리자 | 2022-09-26 | 285 |
| 182 | KPIA, Top 3.3% (AAA grade) in the 22 COSD institutional status report | 관리자 | 2022-09-01 | 305 |
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관리자 2022-11-07 Hit 831
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관리자 2022-11-01 Hit 643
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관리자 2022-10-28 Hit 336
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관리자 2022-10-26 Hit 630
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관리자 2022-10-26 Hit 282
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관리자 2022-10-24 Hit 591
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관리자 2022-10-19 Hit 801
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관리자 2022-10-06 Hit 314
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관리자 2022-09-26 Hit 285
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관리자 2022-09-01 Hit 305