Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 244 | IEC TC91 Experts meeting | 관리자 | 2024-02-21 | 1,309 |
| 243 | MOU with ULSAN COLLEGE | 관리자 | 2024-01-30 | 546 |
| 242 | em |
관리자 | 2024-01-16 | 818 |
| 241 | MOU with KTC(Korea Testing Certification Institute) | 관리자 | 2023-12-19 | 713 |
| 240 | MOU with IEEC(Integrated Electronics Engineering Center) | 관리자 | 2023-12-18 | 612 |
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 599 |
| 238 | R&D Workshop on Substrate Material Technology Development Project for High-Speed... | 관리자 | 2023-11-20 | 1,317 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 694 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 2,439 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 1,356 |
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관리자 2024-02-21 Hit 1,309
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관리자 2024-01-30 Hit 546
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관리자 2024-01-16 Hit 818
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관리자 2023-12-19 Hit 713
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관리자 2023-12-18 Hit 612
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관리자 2023-11-22 Hit 599
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관리자 2023-11-20 Hit 1,317
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관리자 2023-11-13 Hit 694
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관리자 2023-11-10 Hit 2,439
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관리자 2023-11-10 Hit 1,356