Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 239 | MOU with TONGMYONG UNIVERSITY | 관리자 | 2023-11-22 | 513 |
| 238 | R&D Workshop on Substrate Material Technology Development Project for High-Speed... | 관리자 | 2023-11-20 | 1,110 |
| 237 | MOU with PCEA(Printed Circuit Engineering Association) | 관리자 | 2023-11-13 | 567 |
| 236 | ICAE2023 : Advanced Packaging Integration Technology | 관리자 | 2023-11-10 | 2,185 |
| 235 | IEC TC91 (Electronics Assembly Technology) 2023 Jeju Meeting | 관리자 | 2023-11-10 | 1,168 |
| 234 | [NEWS] KPIA holds IEC TC91 international standards meeting in Jeju | 관리자 | 2023-11-10 | 503 |
| 233 | [News] Standard by KPIA become an international standard for Packaging Integrati... | 관리자 | 2023-11-08 | 574 |
| 232 | IEC TC91 (Electronics Assembly Technology) Experts Committee | 관리자 | 2023-10-31 | 1,160 |
| 231 | De facto International Standards (IPC) Forum in electronic assembly technology | 관리자 | 2023-10-31 | 1,170 |
| 230 | 25th Semiconductor Exgibition 2023 | 관리자 | 2023-10-30 | 544 |
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관리자 2023-11-22 Hit 513
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관리자 2023-11-20 Hit 1,110
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관리자 2023-11-13 Hit 567
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관리자 2023-11-10 Hit 2,185
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관리자 2023-11-10 Hit 1,168
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관리자 2023-11-10 Hit 503
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관리자 2023-11-08 Hit 574
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관리자 2023-10-31 Hit 1,160
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관리자 2023-10-31 Hit 1,170
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관리자 2023-10-30 Hit 544