Activity
Activity
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 292 | SMTA KOREA AG Technical Committee | 관리자 | 2025-02-24 | 432 |
| 291 | Package substrates technology experts meeting for 2.1D Packaging | 관리자 | 2025-02-24 | 432 |
| 290 | 2025 SMTA Wafer Level Packaging Symposium | 관리자 | 2025-02-19 | 558 |
| 289 | MOU with SIPC | 관리자 | 2025-02-14 | 37 |
| 288 | 2025 em |
관리자 | 2025-01-20 | 554 |
| 287 | 2024 COSD Performance Sharing Meeting | 관리자 | 2024-12-20 | 489 |
| 286 | Burn-in-Board R&D experts workshop | 관리자 | 2024-12-11 | 499 |
| 285 | Inter-Ministry Workshop on the Development of Substrate Materials Technology for ... | 관리자 | 2024-12-09 | 528 |
| 284 | Training program for semiconductor packaging engineers | 관리자 | 2024-12-05 | 502 |
| 283 | General meeting and conference of the de facto standardization forum | 관리자 | 2024-12-04 | 484 |
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관리자 2025-02-24 Hit 432
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관리자 2025-02-24 Hit 432
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관리자 2025-02-19 Hit 558
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관리자 2025-02-14 Hit 37
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관리자 2025-01-20 Hit 554
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관리자 2024-12-20 Hit 489
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관리자 2024-12-11 Hit 499
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관리자 2024-12-09 Hit 528
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관리자 2024-12-05 Hit 502
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관리자 2024-12-04 Hit 484