< Glass Advanced Packaging Technology for AI Era >

1. Date & Time: August 27, 2026 (Thu) 10:00 – 17:50

2. Venue: Suwon Convention Center, Suwon

3. Schedule:

10:00 – 10:30 / Advanced Packaging market trend / Gary Hung / YOLE

10:30 – 11:10 / Ajinomoto's Material Innovations: Addressing Signal Integrity and Power Management in Advanced Semiconductor Packaging / Habib Hichri / AJINOMOTO

11:20 – 12:00 / Semiconductor substrate technology and market / Zoey Wang (Analyst) / PRISMARK

13:10 – 13:40 / Semiconductor packaging technology for AI chips / Min-seok Seo (Executive Director) / Camtek

13:40 – 14:20 / PCB Thermal Design Methods for Small Surface-Mount Components in Electronic Devices / Yoshinori Aruga (Director) / KOA

14:20 – 14:40 / EDA (Electronic Design Automation) perspective: System-Level Sign-Off Challenges for Chiplet-Based and Heterogeneous Integrated Chip Systems / Catalin Tugui (CEO) / AMSIMCEL

14:40 – 14:55 / Reliability Center and Corporate Support for Future Vehicle System Semiconductors / Chang-hoon Lee (Head of Division) / KTC

15:10 – 15:40 / Chemical Mechanical Planarization for Advanced Packaging: Challenges and Collaborative Opportunities / Prof. Ji-hoon Seo / Hanyang University

15:40 – 16:10 / Photosensitive glass for packaging substrates / Yun-ki Jeon (Team Leader) / LX Glass

16:10 – 16:40 / Integrated Metrology, Inspection and Defect Analysis Solutions for Advanced Glass Substrates / Hyun-jin Tak (Director of Research Institute) / AKC

16:40 – 17:00 / New glass core technology supporting PLP-scale large areas / Jin-hyun Cho (CEO) / cools

17:00 – 17:30 / Glass Core Substrates for AI: Challenges & Future / Andres Ostmann Director / Fraunhofer IZM