< IC Substrate Material IPC Kick-off Meeting >

- Date/Venue: July 16, 2026; Osong & Sejong Conference Room

- Agenda:

1. Overview of GEA

2. Definition and Necessity of Target Technologies (FC-BGA substrates and materials, laminate materials for semiconductor substrates, etc.)

3. Development Objectives and Scope (Substrates and materials for semiconductor packaging)

4. Expected Benefits

5. Examples and Reference Standards for IPC Material Standards