< AI Semiconductor Electronics Packaging Technology Seminar >

DATE : JUNE 12, 2026

VENUE :  STK 2026 COEX HALL C

- Measuring and Controlling Warpage for Advanced Semiconductor Packaging Prof. Kim Taek-soo KAIST

- Characteristics and Reliability of IPL Soldering for AI Semiconductor Packaging Prof. Sohn Yoon-chul Chosun University

- Shaping the Future of AI: Advances in Semiconductor Architecture, Memory, and Packaging Prof. Kim Sung-jin Chungbuk National University