< CPO & Glass Advanced Packaging Technology in the Era of AI Semiconductors >

1. Date: April 1, 2026 (Wed) 10:00 ~ 17:30

2. Venue: Suwon Convention Center, Room 104

3. Schedule:

10:00 – 12:00 / Co-Packaged Optics – Heterogeneous Integration of Photonic IC and Electronic IC / John H Lau, Ph.D / Unimicron

13:30 – 14:20 / AI Semiconductor Market Outlook / No Geun-chang, Executive Vice President / Hyundai Motor Securities

14:30 – 15:00 / AI Technology-Based Smart SMT Packaging Solution / Professor Park Seung-bae / BINGHAMTON UNIVERSITY

15:05 – 15:35 / Nano Imprint Technology / Kim Tae-wan, Executive Vice President / Gigalane

15:40 – 16:20 / Semiconductor Substrate Technology and Market / Daniel Wang, Ph.D / PRISMARK

16:30 – 17:00 / AI chip technology for generative AI models / Nishio Toshihiko CEO / SBR Technology

17:00 – 17:30 / Advanced Packaging and Glass substrate technology and market / Bilal Hachemi CEO / YOLE Group