Advanced Electronic Packaging Technology and Market Seminar

1. Date and Time: Friday, August 30, 2024, 10:10 AM - 4:30 PM

2. Venue: Suwon Convention Center 205-206

3. Schedule:

10:00 – 10:45 / Package for AI, AI for Package / Hee-Seok Lee, Senior Vice President, Samsung Electronics

10:50 – 11:35 / Flux-less TCB for fine pitch applications and its extension to Cu-Cu TCB / Peter van Emmerik, Kulicke & Soffa

11:40 – 12:25 / Interconnection technology in the contemporary semiconductor packaging industry / Professor Yoon-Cheol Son, Chosun University

13:30 – 14:15 / Advanced Packaging Technology & Solution for AI and High-Performance Computing Device-Chiplet & Integration / Jong-Heon Kim, Vice President, Nepass

14:20 – 15:05 / Recent market and technology trends of PCB materials / Zoey Wang, Prismark 

15:10 – 15:40 / The Foundation of Reliability and Verification Center for Advanced vehicle of electronic components ans system semiconductor / Center Director Kim Dong-wook, KTC 

15:45 – 16:30 / Computing & AI advanced packaging Market and technology / Gabriela Pereira, Yole