Activity
Meeting
2024 JIC Conference, Tokyo, Japan
관리자
2024-06-18
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2024 JIC Conference, Tokyo, Japan
JIC (Jisso International Council), 2024 Spring Meeting
June 10, 2024 (Monday), AP Tokyo Marunouchi, TOKYO, Japan
| Time | Country | Title | Speaker |
| Opening Session | |||
| 9:00-9:05 | JP | Opening speech | Toshiro Hiramoto, Chair, JNC |
| 9:05-9:10 | JP | Congratulatory speech by guests of honor | Ryoji Ninomiya, JEITA |
| 9:10-9:15 | JP | Congratulatory speech by guests of honor | Tatsuo Takeshige, METI |
| Technical Session | |||
| 9:20-9:50 | JP | Heterogeneous Integration | Hiroyoshi Yoshida, Nuvoton Technology Corporation Japan |
| 9:50-10:20 | US | The Component Digital Thread” and it is based off the JEDEC JEP30 PartModel Guidelines | Michael Durken, Siemens |
| 10:20-10:50 | Break Time | ||
| 10:50-11:20 | JP | IEC 63055/IEEE 2401 LSI Package Board(LPB) Interoperable Design | Yoshinori Fukuba, Toshiba |
| 11:20-11:50 | JP | Thermal management | Shuhei Ono, Rohm |
| 11:50-13:30 | Lunch | ||
| 13:30-14:00 | CN | Application of thermal imaging analysis technology in PCB industry | Jiong Dai (tentative), Shennan Circuits Co., Ltd. |
| 14:00-14:30 | JP | The value and considerations of MID through additive manufacturing | Osamu Otani, OMRON |
| 14:30-15:00 | KR | B-Stage Polymer Adhesive Films for Electronic Packaging Applications | KyungWook Paik, KAIST |
| 15:00-15:30 | Break Time | ||
| 15:30-16:00 | DE | Additive manufacturing for electrotechnology – a joint standardization approach by IEC TC 91, TC 112, and ISO/TC 261 | Hansgeorg Haupt, Technical University of Darmstadt |
| 16:00-16:30 | FI | Ecodesign of power electronic systems – current state and target setting | Mervi Paulasto-Kröckel and M. Sc. Mostafa Radwan, Aalto University |
| 16:30-17:00 | DE | Sintering | Andreas Karch, Indium |
| 17:00-17:05 | Wrap and closing | Udo Welzel, Chair, IEC TC91 |
