1. Date & Time: June 4, 2026 (Thu), 10:00 – 17:00

2. Venue: Suwon Convention Center, Rooms 205 & 206

3. Schedule:

10:00 – 10:50 / Changes in the Semiconductor Glass Packaging Market and Future Outlook / Geun-Chang Noh, Executive Vice President / Hyundai Motor Securities

11:00 – 11:40 / Non-destructive Inspection Solution for Micro-defects in TGV Process / Lee Gap-soo, CEO / innometry

11:50 – 12:30 / Pore-free High-Density Copper Plating Technology for Glass Substrates / Kim Seong-bin, CEO / ANYCASTING

13:40 – 14:20 / Sintered Cu Paste as Via-Filling Material for Through-Glass Via / Yoshinori Ejiri / RESONAC

14:30 – 15:10 / Glass Core Technology for Energy-Efficient High-Density Al Packaging / Satoru Kuramochi / DNP

15:20 – 16:00 / LPKF-Proposal - Glass Substrates, Beyond TGV to CPO / Lee Yong-sang, CEO / LPKF

16:10 – 16:50 / Trends in Glass Substrate TGV Technology Development / Oh Jeong-won Managing Director / JWMT