Advanced Electronic Packaging Technology and Market Seminar - 1

1. Date: 2025.04.02 (Wedn) 10:00 ~ 17:00 

2. Venue: Suwon Convention Center 103-104

3. Schedule:

10:00 – 10:30 / Semiconductor rebound in 2024 revenus surge driven by gen AI processor and HBM rise / Emilie Jlivet Analyst / YOLE

10:40 – 11:30 / Semiconductor industry market trends and outlook / Noh Geun-chang, Executive Director /  Hyundai Motor Securities

11:40 – 12:30 / Semiconductor high-density packaging technology trends / Kang In-soo Executive Director / Nepass

13:40 – 14:20 / Data-centric industry ecosystem construction strategy / Professor Lee Joo-seok / Yonsei University (former Intel Vice President)

14:30 – 15:10 / AI chip packaging technology trends / Nishio Toshihiki CEO / SBR Technology

15:20 – 16:00 / Latest trends in heat dissipation substrate materials / Choi Ho-kyung Managing Director / Shin-A T&C

16:00 – 16:50 / Scalable packaging solutions for optical switches by embedding / Marius Adler Ph.D. / Fraunhofer