<Advanced Packaging Technology for the Future>

- Date: 2025.06.13 (Fri) 13:00 ~ 16:10

- Venue : COEX GSCon Seminar Room

- Schedule

13:00 – 13:10 / Introduction to Future Car System Semiconductor Components Reliability Verification Center / Lee Chang-hoon / KTC

13:10 – 13:25 / Introduction of Advanced Package Research Results  / Park Kyung-ho / KANC

13:25 – 13:55 / ALD (Atomic Layer Deposition)-based nano ceramic coated wire bonding technology / Park Soo-jae / Oxwires

13:55 – 14:10 / Testbed for semiconductor packaging /  Yang Chung-mo / NNFC

14:10 – 14:40 / New Opportunity: Semiconductor Packaging Integration and Chiplet / Kim Sung-dong / Seoul Tech

14:40 – 15:10 / (Non)pressure for electric vehicle power module packages Sintering bonding technology / Hong Won-sik / KETI

15:10 – 15:40 / Mechanical Reliability of Thin Film Materials for Semiconductors, Displays, and more / Taesoo Kim / KAIST

15:40 – 16:10 / Advanced packaging technology to make future AI semiconductors / Choi Kwang-sung / ETRI