Activity
Seminar
| No | Title | Name | Registration Date | Hit |
|---|---|---|---|---|
| 64 | Reliability of Future Automotive Semiconductors | 관리자 | 2026-04-02 | 67 |
| 63 | CPO & Glass Advanced Packaging Technology in the AI Era | 관리자 | 2026-04-01 | 97 |
| 62 | The Pan Pacific Strategic Electronics Symposium (Pan Pac) | 관리자 | 2026-02-06 | 214 |
| 61 | ICAE 2025_Session 14. Advanced packaging & substrate | 관리자 | 2025-11-25 | 530 |
| 60 | IPC K-FEST 2025 | 관리자 | 2025-11-04 | 569 |
| 59 | TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 2 | 관리자 | 2025-08-28 | 630 |
| 58 | TGV, CPO, and Power and Thermal Advanced Packaging Technology Seminar - 1 | 관리자 | 2025-08-27 | 551 |
| 57 | Glass substrate TGV technology Seminar | 관리자 | 2025-07-24 | 681 |
| 56 | SMTA KR AG Technical Committee Symposium | 관리자 | 2025-06-13 | 609 |
| 55 | KPIA Advanced Electronic Assembly Technology Seminar | 관리자 | 2025-06-12 | 527 |
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관리자 2026-04-02 Hit 67
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관리자 2026-04-01 Hit 97
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관리자 2026-02-06 Hit 214
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관리자 2025-11-25 Hit 530
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관리자 2025-11-04 Hit 569
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관리자 2025-08-28 Hit 630
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관리자 2025-08-27 Hit 551
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관리자 2025-07-24 Hit 681
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관리자 2025-06-13 Hit 609
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관리자 2025-06-12 Hit 527