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SMTA International 2026, KPIA Korea Session

관리자 2026-10-28 Number of views 93

SMTA International 2026, KPIA Korea Session


APT3: Korean Packaging Integration Association
Wednesday October 28, 2026 4:30pm - 6:00pmCDT
Room 48
Session Chair: Sung-Jin Kim, Chungbuk National University
Session Co-Chair: HyunHo Kim, Korea Packaging Integration Association 
4:30pm-5:00pm
AI and HPC Advanced Packaging Technology
Presenter: YoungDo Kweon, AMKOR Technology

5:00pm-5:30pm
Metal- Oxide Sphere-Structured Thermal Interface Material for Efficient Heat Dissipation
Presenter: Jinsub Park, Ph.D., Hanyang University

5:30pm-6:00pm
Comprehensive review on Artificial Synaptic Devices with Amorphous Oxide Semiconductor Thin Film Transistors  for Neuromorphic Computing: Materials, Devices, and Emerging Applications
Presenters: Sang Yeol Lee, PhD., Gachon University
Co-Authors: Sandeep Kumar, Hyeonji Kim, Gachon University

https://www.smtai.org/technical-program



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