< Glass Advanced Packaging Technology for the AI ​​Era >

1. Date & Time: August 26, 2026 (Wed) 10:00 – 17:00

2. Venue: Suwon Convention Center, Suwon

3. Schedule:

10:00 – 10:40 / CPO Technology Development Trends and Integration Strategies with Advanced Packaging / Gwang-Seong Choi, Head of Division / ETRI (Electronics and Telecommunications Research Institute)

10:40 – 11:10 / CPO Market and Related Trends by Company / Martin Vallo / Yole Group

11:20 – 12:00 / FCBGA Substrate Market and Emerging Packaging Technologies (CPO) / Tadashi Kamewada, CEO / AZ Supply Chain Solutions

13:10 – 13:40 / Status of Government R&D Projects and Introduction to Key Technologies / Seok-Hee Lee, Team Leader / Next-Generation Intelligent Semiconductor Project Group

13:40 – 14:20 / Trends and Analysis of High-Speed ​​Optical Interconnect Technology for AI Infrastructure Data Centers / Se-Kyung Kang, CEO / Inoptics

14:20 – 15:05 / Package-to-Package Optical Connections via CPO / Toshihiko Nishio, CEO / SBR Technology

15:20 – 16:00 / PIC Packaging Enabled by Glass Substrates and Photonic Wire Bonding / Dr. Henning Schröder / Fraunhofer IZM

16:00 – 16:15 / Status of NNFC Advanced Packaging Infrastructure Development / Jae-Seop Oh, Senior Researcher / NNFC (National Nanofab Center)

16:20 – 17:00 / Advances in Optical Interconnects in Hyperscale AI Environments / Richard Pitwon, CEO / Resolute Photonics