Embedding 2025 - JISSO Information sharing forum (2025-01-20)  한·독·일 embedding technology 정기포럼

Welcome at Fraunhofer IZM: Dr. Rolf Aschenbrenner (General chair)

Greeting & Explanation on aim: Dr. Yoshihisa Katoh (co-General chair) 

"Updated overview about Fraunhofer IZM”by Dr. Rolf Aschenbrenner (Deputy Director of Fraunhofer IZM)

Session A: Current statusand future, of device embedded substrates and related technologies

Speech 1:(Japan 1)”Production of device embedded substrate by additive manufacturing (Tentative)” by Dr. Ryojiro Tominaga (FUJI CORPORATION)

Speech 2:(ITRI, Taiwan)” Development and evaluation of low dielectric loss encapsulant for high frequency device application” by Dr. Lin Chih-hao

Speech 3: (Japan 2）”Development of 3D wiring technology (Tentative)” by Mr. Junichi Torii (Fujikura Ltd.)

Speech 4: (KPIA, Korea) “Packaging Technology trend of HBM and SiPfor the AI era” by Ph. D. MinsukSuh, CTO (CamtekKorea)

Speech 5:(Japan 3）”Extremely Advanced Substrate as an Integrated Package Solution (iPaS) for Next Generation High Performance Computing (HPC) Applications” by Mr. Tatsuya KITAMURA (Murata Manufacturing Co., Ltd.)

Session B: Updated status on IEC standardization activities and Embedding Assembly Technology (IEC TC91 & WG6: Electronic Assembly Technology & Device Embedding AssemblyTech.)

“Proposal on evaluation method of heat transfer for stacked electronic modules (The future IEC 62878-2-604)” by Dr. Yoshihisa Katoh (Fukuoka univ.) by Mr. Satoshi Kojima (Kojima eDesign office)

“Updated standardization activity on IEC TC91 including LCG/JIC” by Mr. Walter Huck (DKE K682, IEC TC91)

“Power semiconductors for an energy-wise society (IEC White Paper)” by Mr. Michael Schleicher (Semikron Danfoss & FED e.V.)

“Scalable Packaging Solutions for Optical Switches by Embedding” by Marius Adler (Fraunhofer IZM)

“Development of an adaptive redistribution patterning process for fan-out packages with embedded high I/O components” by Steffen Borchardt (Fraunhofer IZM)

Wrap-up & Closing