KPIA technology and market seminar II

1. Date: April 26, 2024 (Fri)

2. Venue: COEX 308

3. Schedule:

10:00 – 10:50 / SK Hynix semiconductor technology trends / Vice President Ki-il Moon, SK Hynix

11:00 – 11:50 / FC BGA Technology Trends / Tadashi KAMEWADA CEO, AG Supply Solutions

13:30 – 14:20 / SiC semiconductor and packaging technology trends for power / Byeongjin Kim, Manager, Onsemi

14:30 – 15:10 / Metrology & Inspection in Semiconductor Packaging / Research Institute Director Seo Min-seok, Camtek

15:20 – 16:00 / Characteristics of SnBi-based Low Temperature and Hybrid Solders / Professor Jaepil Jeong, University of Seoul

16:10 – 16:50 / PLP and Embedding Technology / Ole HOELCK, Ph.D, Fraunhofer