KPIA technology and market seminar I

1. Date: Thursday, April 25, 2024

2. Venue: COEX 308

3. Schedule:

10:00 – 10:50 / Advanced packaging market and technology trend / Bilal HACHEMI, Yole

11:00 – 11:50 / PCB material technology and trends for high-speed communication / Michael GAY, isola

13:30 – 14:20 / Advanced package technology trends / Senior Byeong-yeon Cho, Samsung Electronics

14:30 – 15:10 / Heterogeneous Integration Packaging Challenges and Solutions / Director Seongjin Park, ASMPT

15:20 – 16:00 / Research on low-temperature-based soldering technology using various materials / Senior Ko Yong-ho, KITECH

16:10 – 16:50 / Robot industry market trends and major issues / General Manager Seo Jun-ho, KAR