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[ICAE2023] Advanced Packaging Integration Technology

관리자 2023-11-10 조회수 561
<ICAE2023 : Advanced Packaging Integration Technology>
- Date : November 2-3, 2023
- Venue : Jeju Ramada Hotel
- Program
B-Stage Conductive Adhesive Films (ACFs and NCFs) Materials for Electronics Packaging Applications Kyung Wook Paik Korea Advanced Institute of Science and Technology, Korea
Potential of Low Temperature Soldering Using Hypoeutectic Sn-Bi Alloys Hiroshi Nishikawa Osaka University, Japan
The Reactions between Gallium and Under Bump Metallizations on Printed Circuit Boards Yoon Chul Sohn Chosun University, Korea
Thermal Engineering Using Photonic Structures Sunmi Shin National University of Singapore, Singapore
Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding Myeongeun Kim, Sukkyung Kang, Sanha Kim, Kyung Min Kim Korea Advanced Institute of Science and Technology, Korea
Al2O3-Coated Bond Wire for Adhesion Promoter & Electrical Insulation Soojae Park OxWires Co., Ltd., Korea
The Materials for the Advanced Package Technology Minsuk Suh SK Hynix Inc., Korea
Reliability Mitigation of Substrates for 2.5D Packages and High Performance Computing Seungbae Park Binghamton University State University of New York, USA
Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in NonConductive Film (NCF) Minwoo Rhee Samsung Electronics Co., Ltd., Korea
Electronic Device Technologies for mm-Wave/THz Applications Using Special Packaging Materials:
Research Overview and Possibility
Jae-Yeong Lee, Eui-Su Lee, Il-Min Lee, Kyung-Hyun Park Electronics and Telecommunications Research Institute, Korea
Technology Trends in Materials for High Speed PCB Minsu Lee Korea Packaging Integration Association, Korea
Development and Standard Trend of PCB Low Dielectric Material for High-Speed Communication Shin Ae Song Korea Institute of Industrial Technology, Korea
The Global Trend of Battery Testing Bumjong Kim Korea Testing Laboratory, Korea
Research Trends on the Design of a Multilayer Radar Absorbing Structure Minseok Han Republic of Korea Naval Academy, Korea
Empirical Modeling and Performance Evaluation of M3D DRAM: Back-Gate Effect and Crosstalk Johak Jeong 1 1 Jeonbuk National University, Korea, 2 SRM Institute of Science and Technology, India
Enhancing the Electrical Properties of 3D Printed Metasurface Phase Shifters through Thermo-Pressing Gyeongyeong Lee 1 1 Kongju National University, Korea, 2 Electrical and Electronic Engineering, Korea, 3 Department of Information
and Communication Engineering, Korea, 4 Hanwha Corporation, Korea