IEC TC91 JIC (Jisso International Council), 2026 Spring Meeting

June 22, 2026, Hong Kong, the office of Robert Bosch

< Opening Session > 

Opening Speech Osamu Ikeda, Secretary, IEC TC 91

Welcome Greeting Beatrice Schan, General Manager, Robert Bosch Co., Ltd. Hong Kong

< JISSO Standardization Activities or Roadmap >

Korea's Jisso standardization activities MinSu Lee, KPIA

China's Jisso standardization activities TBD

Japan Jisso Technology Roadmap Nishimura or Yorita, JJTR

Malaysia Jisso Standardization Activities Bernard Lim, Appscard, Group AS and Appscard, Global Research, Innovation Center

Singapore Jisso Standardization Activities Dr. Teck Kheng Lee,

Germany Jisso Technology Roadmap Walter Huck, GNC

French AFNOR/UF 91 Roadmap Maudet Christian, FNC

< Technical Session >

Liquid Immersion Cooling Technology Hideyuki Nagai, JEITA, TDK

Toward Sustainable Circuit Board Manufacturing Jason Chau, Robert Bosch Company Ltd. & Hiroaki Nasu, Elephantech Inc.

Hong Kong University of Science and Technology. Tim Cheng, the Hong Kong University of Science and Technology

Test Methods and Defect Criteria for Backdrilled Holes in Printed Boards Xin Huang, DELTON TECHNOLONGY (GUANGZHOU) INC.

Improving Hybrid Bonding Interfacial Strength Sungdong Kim, Seoul National University of Science and Technology

SC86C/WG4 ”CPO(Co-Packaged Optics) Richard Pitwon, Resolute Photonics

Wrap and closing Udo Welzel, Chair, IEC TC91