협회활동
실장세미나
[ICAE2023] Advanced Packaging Integration Technology
관리자
2023-11-10
조회수 1,125
<ICAE2023 : Advanced Packaging Integration Technology>
- Date : November 2-3, 2023- Venue : Jeju Ramada Hotel
- Program
| B-Stage Conductive Adhesive Films (ACFs and NCFs) Materials for Electronics Packaging Applications | Kyung Wook Paik | Korea Advanced Institute of Science and Technology, Korea |
| Potential of Low Temperature Soldering Using Hypoeutectic Sn-Bi Alloys | Hiroshi Nishikawa | Osaka University, Japan |
| The Reactions between Gallium and Under Bump Metallizations on Printed Circuit Boards | Yoon Chul Sohn | Chosun University, Korea |
| Thermal Engineering Using Photonic Structures | Sunmi Shin | National University of Singapore, Singapore |
| Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding | Myeongeun Kim, Sukkyung Kang, Sanha Kim, Kyung Min Kim | Korea Advanced Institute of Science and Technology, Korea |
| Al2O3-Coated Bond Wire for Adhesion Promoter & Electrical Insulation | Soojae Park | OxWires Co., Ltd., Korea |
| The Materials for the Advanced Package Technology | Minsuk Suh | SK Hynix Inc., Korea |
| Reliability Mitigation of Substrates for 2.5D Packages and High Performance Computing | Seungbae Park | Binghamton University State University of New York, USA |
| Modeling of Interfacial Reactions between Epoxy and Silica Filler Suspension System in NonConductive Film (NCF) | Minwoo Rhee | Samsung Electronics Co., Ltd., Korea |
| Electronic Device Technologies for mm-Wave/THz Applications
Using Special Packaging Materials: Research Overview and Possibility |
Jae-Yeong Lee, Eui-Su Lee, Il-Min Lee, Kyung-Hyun Park | Electronics and Telecommunications Research Institute, Korea |
| Technology Trends in Materials for High Speed PCB | Minsu Lee | Korea Packaging Integration Association, Korea |
| Development and Standard Trend of PCB Low Dielectric Material for High-Speed Communication | Shin Ae Song | Korea Institute of Industrial Technology, Korea |
| The Global Trend of Battery Testing | Bumjong Kim | Korea Testing Laboratory, Korea |
| Research Trends on the Design of a Multilayer Radar Absorbing Structure | Minseok Han | Republic of Korea Naval Academy, Korea |
| Empirical Modeling and Performance Evaluation of M3D DRAM: Back-Gate Effect and Crosstalk | Johak Jeong 1 | 1 Jeonbuk National University, Korea, 2 SRM Institute of Science and Technology, India |
| Enhancing the Electrical Properties of 3D Printed Metasurface Phase Shifters through Thermo-Pressing | Gyeongyeong Lee 1 | 1
Kongju National University, Korea, 2 Electrical and Electronic Engineering,
Korea, 3 Department of Information and Communication Engineering, Korea, 4 Hanwha Corporation, Korea |
