Liaison Coordination Group
–
Assembly technology, semiconductors, passive components -
Japan: Kasuga, Sakamoto, Fukuba, K.Yamamoto, Tambo,
Ikeda, Okamoto
KR:
Lee
China:
Cai
EU:
Huck, Rapala-Virtanen, Saarinen, Welzel, Hudson, Pudas
USA:
Confirmed without changes
Actual schedule is V5, no questions so far. Refer to
the updated meeting registration system – see AC.
Invitation to Spring meeting 2023 in Helsinki is still
valid.
Coordination with ISO TC 261 and IEC TC 119 as well as
with IPC/ASTM activities is necessary.
GNC started work on a technical report covering all
aspects of sinter technology. Experts cover the whole process chain including
equipment manufacturers and users.
IPC 4922 was under ballot (100% passed, but 20
technical comments received, need to be dispositioned before publication).
Dough Sober is on charge for that project.
GNC project to develop test structures (first perhaps
a TR, depending on the output from ECPE project in Germany), IPC started
similar project (guideline, which considerations should be made; project is
under Bob Neves).
47/2773/NP “Failure mechanisms and measurement methods
to evaluate solid insulation for semiconductor devices” should be studied.
Contact via GNC members is possible. It needs to be clarified, what part is
planned as a standard and what as additional technical information. A clear
separation is necessary.
IEC PAS 61191-10 is published in July.
Looking for experts to support the project “Protection
and packaging of electronic assemblies”. Marko Pudas (FI) volunteers to join
the project team for thin and thick film technologies.
IEC 63215 series will be discussed in next WG3
meeting.
Project 91/1797/NP should be closely discussed with
other TCs
TC91 Project “Resistance against cleaning solvent” is
of high interest for TC40.
Interesting projects on insulating materials and
flexible / stretchable materials (see 47/2777/DC, IEC 62951 series). Interesting for new materials as well for PCB
industry and Semiconductor industry.
See attached Report by Fukuba.
New projects related to thermal characterization
should be studied by TC91 as well to avoid double work.
AEC-Q007 Initial Release (Revision -) – Board Level
Reliability (BLR) Guidelines; AEC-Q007-001 Initial Release (Revision -) – BLR
Temperature Cycling Test Methodology; and AEC-Q007-002 Initial Release
(Revision -) – BLR Spreadsheets
Ballot is done middle of August, comments still need
to be dispositioned before publication.
Nothing specific. Cooperation between IPC and IEC –
preparation of an MoU is ongoing.
Link to project status page:
The project 91/1797/NP is to be aligned with the
project ISO 9455-18
Phase 3 “Conformal coating evaluation for improved
environmental protection”
Project to develop a test board to measure the
effectiveness of cleaning. Evaluate thicknesses and board structure to measure
protection against corrosion.
iNEMI roadmap on organic PCB material, team is going
to be established – in case of interest, contact Tarja.
Summer conference took place as face-to-face meeting.
Technical snapshot seminars are ongoing – see EIPC
Webpage.
Nothing to report.
Solder limits subjects still are under discussion,
like selective, wave soldering. In case actual soldering profiles are
available, send to Emma.
Project on requirements and testing of conformal
coating of agricultural lighting is ongoing.
FED Conference September 29/30 with 38 contributions
in four tracks. Details: www.FED-Konferenz.de
Of special interest: Expert round talk on “digital
solder resist” with experts from Agfa, Altium, Electra Polymers, FlowCAD, MEC,
Notion, Peters, Taiyo and Würth.
TC 86 IEC
62496-2-5 ED1 Optical circuit boards - Basic test and measurement procedures -
Part 2-5: Flexibility test for flexible opto-electric circuits
86/591/CDV 2017-12 2022-08
CFDIS 2022-11
JWG 9 Young-Min Im 2023-01
October 20th, starting from 13:30 UTC.