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JIC Conference 2022, (online)
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2022-10-10
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| JIC presentation 2022 | ||||
| Tuesday, 17th May | ||||
| No. | Presentation title | Presenter | NC | Estimated time |
| Opening of the meeting | Dr. Masahide Okamoto | 5 min | ||
| 1 | Conformal coating with ALD for space and medical applications; PCB & Assembly protection | Marko Pudas, Picosun Oy | FI | 30 min |
| 2 | Thermal management-related | Dr. Tomoyuki Hatakeyama Dr. Kazuaki Sanada Dr. Takashi Fukue | JP | 30 min |
| 3 | Impacts and challenges of AME, from design to data | Michael Schleicher | DE | 30 min |
| 4 | Package Substrate by Reel-to-Reel Processes | Dr. Byun, Jungsoo Senior Managing Director HAESUNG DS | KR | 40 min |
| Break | 5 min | |||
| 5 | Advanced semiconductor package | Prof. Dr. Yoshihisa Katoh | JP | 30 min |
| 6 | Laser-based Manufacturing of Electronic Layers | Dr. Christian Vedder | DE | 30 min |
| 7 | USA-JISSO Update 2022 - Efforts and Plans for dvanced Electronics Packaging | Mr. Dennis Fritz | US | 30 min |
| Closing remarks | Dr. Udo Welzel | 10 min | ||