JIC presentation 2022 | ||||
Tuesday, 17th May | ||||
No. | Presentation title | Presenter | NC | Estimated time |
Opening of the meeting | Dr. Masahide Okamoto | 5 min | ||
1 | Conformal coating with ALD for space and medical applications; PCB & Assembly protection | Marko Pudas, Picosun Oy | FI | 30 min |
2 | Thermal management-related | Dr. Tomoyuki Hatakeyama Dr. Kazuaki Sanada Dr. Takashi Fukue | JP | 30 min |
3 | Impacts and challenges of AME, from design to data | Michael Schleicher | DE | 30 min |
4 | Package Substrate by Reel-to-Reel Processes | Dr. Byun, Jungsoo Senior Managing Director HAESUNG DS | KR | 40 min |
Break | 5 min | |||
5 | Advanced semiconductor package | Prof. Dr. Yoshihisa Katoh | JP | 30 min |
6 | Laser-based Manufacturing of Electronic Layers | Dr. Christian Vedder | DE | 30 min |
7 | USA-JISSO Update 2022 - Efforts and Plans for dvanced Electronics Packaging | Mr. Dennis Fritz | US | 30 min |
Closing remarks | Dr. Udo Welzel | 10 min |