Time

Country

Title

Speaker

Opening Session

9:00-9:05

JP

Opening speech

Toshiro Hiramoto,

Chair, JNC

9:05-9:10

JP

Congratulatory speech by guests of honor

Ryoji Ninomiya, JEITA

9:10-9:15

JP

Congratulatory speech by guests of honor

Tatsuo Takeshige, METI

Technical Session

9:20-9:50

JP

Heterogeneous Integration

Hiroyoshi Yoshida,

Nuvoton Technology Corporation Japan

9:50-10:20

US

The Component Digital Thread” and it is based off the JEDEC JEP30 PartModel Guidelines

Michael Durken,  Siemens

10:20-10:50

Break Time

10:50-11:20

JP

IEC 63055/IEEE 2401 LSI Package Board(LPB) Interoperable Design

Yoshinori Fukuba,

Toshiba

11:20-11:50

JP

Thermal management

Shuhei Ono, Rohm　

11:50-13:30

Lunch

13:30-14:00

CN

Application of thermal imaging analysis technology in PCB industry

Jiong Dai (tentative), Shennan Circuits Co., Ltd.

14:00-14:30

JP

The value and considerations of MID

through additive manufacturing

Osamu Otani, OMRON

14:30-15:00

KR

B-Stage Polymer Adhesive Films for Electronic Packaging Applications

KyungWook Paik, KAIST

15:00-15:30

Break Time

15:30-16:00

DE

Additive manufacturing for electrotechnology – a joint standardization approach by IEC TC 91, TC 112, and ISO/TC 261

Hansgeorg Haupt, Technical University of Darmstadt

16:00-16:30

FI

Ecodesign of power electronic systems – current state and target setting

Mervi Paulasto-Kröckel and M. Sc. Mostafa Radwan,

Aalto University

16:30-17:00

DE

Sintering

Andreas Karch, Indium

17:00-17:05

Wrap and closing

Udo Welzel, Chair, IEC TC91