[ JIC Busan Conference ]
– Date : Oct. 25, 2018
– Venue : The Bay 101
– Agenda :
<1>JISSO activities in Europe (Murata)
<2>JISSO activities in Japan (Toshiba)
<3>JISSO activities in North America (Essex Technologies Group Inc.)
<4>JISSO activities in Korea (JKC)
<5>The future of whisker testing (Bosch)
<6>Whisker data related issue (Reliability conditions) (Omron)
<7>JWG9 projects :“TC91 and TC86” (KETI)
<8>Device Embedded Module (METI national PJ in Japan) (IS-INOTEK)
<9>Wearable Electronic -Standards for e-textiles (IPC)
<10>Power Device Assembly in Europe (Bosch)
<11>Advanced Package Test Solution (Nidec-read)
<12>Current technical challenges in package warpage measurement during SMD and the need of insitu warpage measurement (Micron Korea)
<13>IoT/SiP/Module(New Packages) Test Solutions (Advantest Korea)
<14>Embedded Component Package Technology Trend (AT&S)
<15>Korea PCB Industry 2018 (KPCA)
<16>New Applications of High Modulus RCC for the Semiconductor Package Substrate
<17>Various Bonding process for FO technology in WLP and PLP (ASM)
<18>Performance of Fan-out Package and Its Applications (NEPES)
<19>Trends of Fan-out Panel Level Packaging (Fraunhofer IZM)