Embedding Technology International Forum in Berlin, Germany

1. Date : January 17, 2022

2. Venue : Berlin, Germany (Hybrid : Online&offline)

3. Attendees : 

- Fraunhofer IZM (DE)

- IEC TC91 German National Committee (DE)

- IEC TC91 Japanese National Committee / METI Project / JIEP / JEITA (JP)

- Korea Packaging Integration Association – JKC(Jisso Korea Council) (KR)

- TPCA / ITRI (TW)

4. Agenda

- Status and Progress of IZM Panel Level Consortium 2.0:

- Extreme fine line horizontal and vertical routing for FOPLP

- State of the art glass substrates for PLP, electro-optical boards and interposer technology

- 3D embedded substrate with cavity structure

- Latest development status of EC2AMTM

- Evaluation of Half-Bridge Power Module with POL-kW

- Updated standardization activity on IEC TC91 including the future IEC 62878-2-9 (Concept of Jisso level)

- Updated development status on the test method of electrical connectivity based on knowngood-module (KGM) for the stacked electronic module