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- Date : 2024-01-15

- Venue : Fraunhofer IZM Berlin

- Agenda :

Welcome at Fraunhofer IZM: Rolf Aschenbrenner (General chair)

Greeting & Explanation on aim: Dr. Yoshihisa Katoh (co-General chair)

"Updated overview about Fraunhofer IZM” by Rolf Aschenbrenner (Deputy Director of Fraunhofer IZM)

Speech 1: “Update Embedding Technology” by Dr. Andres Ostmann (Fraunhofer IZM)

Speech 2: “Japan National Project for Thermal Management on Small Surface Mount Components” by Prof. Tomoyuki Hatakeyama (Toyama Prefectural University, Japan)

Speech 3: “Power Module Package Material and It's Evaluation Platform” by Dr. Kai-Chi Chen (ITRI, Taiwan)

Speech 4: "LMCE glass process for glass substrate“ by Dr. Hyunho Kim (KPIA, Korea)

“Proposal on the evaluation method of heat transfer for stacked electronic modules (the future IEC 62878-2-604)”

25 13:00 13:25 on site by Dr. Yoshihisa Katoh (Fukuoka univ.) by Mr. Satoshi Kojima (Kojima eDesign office)

“Updated standardization activity on IEC TC91 including LCG/JIC activities on Power module with new embedding technologies" by Mr. Walter Huck (DKE K682, IEC TC91)

“Embedded IGBT Chips 1200 V using integrated liquid cooling (Insulating coolant)” by Prof. Till Hüsgen (University of Applied Sciences, Kempten)

“Standardization activity on IEC TC47/SC47D including Power Module and Heterogeneous Integration” by Mr Hiroyoshi Yoshida (Nuvoton, IEC SC47D Secretary)

Molded Power Pre-Package by Tina Thomas (Fraunhofer IZM)

“Standardization supporting for energy efficient and sustainability in ICT“ by Dr. Hans Walter (Fraunhofer IZM)

“Prototyping and Evaluation of SiC Half Bridge Circuit using Power Device Embedded Module Process Towards Future Three Dimensional Packaging" by Mr. Kazuhito Nakamura（Nagoya University）

The future activities in FY2024

- IMPACT 2024 in Taipei on 2024-10-23 to 25

- International study on Power Module (with device embedding technology)

- Next meeting, Embedding 2025, in Berlin on 2025-01-13 or 20 (Mo)