< Embedding Technology Experts meeting : 한국.독일.일본.대만 >

  - Date : 2023. 01. 16

  - Venue : Fraunhofer IZM Berlin and on-line

  - Technology seminar and experts discussion

#1. 09:15 “Updated overview about Fraunhofer IZM” by Dr. Rolf Aschenbrenner

#2. 09:30 “Interaction of Thermal Management and Reliability in PCB Assemblies” by Dr. Olaf Wittler (Fraunhofer IZM, Germany)”

#3. 10:40 “Energy efficient liquid cooling for semiconductors and batteries” by Professor Young-suk Nam (KAIST, Korea)

#4. 13:00 “Lifetime of embedded power electronics” by Mr. Matthias Hammerl (Vitesco Technologies)

#5. 13:00 “IEC TC91 Activities related to embedding technology” by Mr. Walter Huck (DKE K682, IEC TC91)

#6. 1320 “Proposal on thermal management for stacked electronic module (Evaluation method)(the future IEC 62878-2-604)” by Dr. Yoshihisa Katoh (Fukuoka univ.)

#7. 1330 “Introduction of Device Embedded Module technology & CSIPOS” by Mr. Atsunori Hattori(Fukuoka IST) and Mr. Taka Kanayama (Fukuoka univ.)

#8. 13:50 “Update Panel Level Consortium (Panel Level Packaging)” by Dr. Tanja Braun (Fraunhofer IZM)”

#9. 14:10 “Update Embedding technology (Fraunhofer IZM Substrate Technologies 2030+)” by Dr. Andres Ostmann

Participants on site at Fraunhofer IZM Berlin (2023-01-16)