1. Date : January 25, 2021

2. Venue : online

- PLP Status
▪ What in Large Area Panel Level Packaging ?
▪ Panel Level Packaging
▪ Embedding technology
▪ Merging of technologies, materials and equipment from Wafer, PCB, LCD,.. technologies
▪ Not really a question fo size
- Fan-Out Panel Level Packaging
▪ Mold embedding approach
▪ Processing on large area formats
▪ Driven by cost reduction and potential for large □ SiPs

- FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM
▪ ORGANIZATIONAL STRUCTURE
▪ Merging of Wafer-and Panel-Level Technlogies
▪ Packaging Lines
▪ R&D Highlights

- Substrate Embedding
▪ Substrate Embedding
▪ Process
▪ Test Vehicle
▪ Application Project Serena
▪ Strategic Research 6G SENTINEL
▪ Summary

- Latest development status of EOMINTM wiring board with embedded componet
▪ Introduction of EOMINTM
▪ Via bonding technology for embedded component
▪ Contribition for increasing module performance
▪ Densifying EOMINTM
▪ Development status for low-warpage EOMINTM with embedded active
component

- Embedded Structure for PCB Thermal Solution in High-Speed Optical Module
▪ PCB Applications for 5G
▪ Optical Module Survey
▪ Unimicron’s Embedded Heat Slug Technology
▪ CONCLUSIONS

- Test method of electrical connectivity based on known-good-module
(KGM) for the stacked electronic module (Dr. Satoshi Kojima)
▪ New technology driver – AI edge devices
▪ Stacked electronic module
▪ IEC 62878-2-600 series – guideline for stacked electronic module
▪ Future IEC 62878-2-603 KGM based approach I2G bidirectional bus
Test method
▪ Survey on IEC 63011-5

- Development of Device Embedded Module with Cavity Structure
(Dr. Hyunho Kim)
▪ Korea Packaging Integration Association
▪ Packaging Integration Trend
▪ Device embedded Module