Opening

Hyunho Kim / KPIA-JKC

JEITA Jisso Activities in Japan

Ryoji Ninomiya / Toshiba Electronic Devices & Storage Corporation

Whisker and related JISSO Material in JEITA standardization Group

Ichizo Sakamoto / S.C.L

Introduction and application of laser assisted bonding (LAB)

Yoonchul Sohn / Chosun University

Advances and Challenges in Additively Manufactured Electronics (AME) Devices from design to data

Jaim Nulman / NanoDimension

Disruptive approach in the design and tool chain of additively manufactured circuit boards

Michael Schleicher / Semikron

Revision of IEC61760-3 Ed1 : “Surface mounting technology of through-hole reflow(THR)　soldering. ”  and  “Guidelines for through hole diameter design with solder paste surface printing method.”

Chiko Yorita / Hitachi, Ltd

Changes in thermal management caused by progress in surface mount technology

Takashi Fukue / Kanazawa institute of technology

Closing

Udo Welzel / Robert Bosch GmbH