•2018 JIC# 19 Fremont, USA (JNAC)
– JIC (Jisso International Council)– Date : 2018.05.13 ~ 05.20
– Fremont, USA
– 참석인원: 8개국 40여명
– 각 국가별 실장기술 표준화 동향 및 로드맵에 대해서 발표함.
– Fan-out PLP 기술동향, TC91에서 계속적인 중인 프로젝트를 발표함.
– 웨이러블 전자와 관련된 TC간의 협력현황 공유함.
– 일본 실장기술의 표준화 전략을 발표함.
– Terminology, JISSO level 관련하여 아래의 부분에 대한 용어를 WG5에서 논의되도록 용어를 정리하여 부산미팅에서 joint
미팅 진행 예정.
– TC91/WG6 projects (IEC 62878- series)
– WG6 title and scope has been changed into “Device embedding assembly
technology”
– A new series of standards with different number shall be considered in
preparation of Busan meeting to cover the new projects.
– IEC 62878-1: CD is circulated, deadline for comments is May 18th.
– Device embedded module: Interface and relation to TC 47 &SC 47A and
SC 47D to be clarified, a joint project is needed. NP draft is scheduled for
discussion at Busan meeting in October.
– Warpage: Describe method as TC91 TR, SC47D can share and discuss
applicability for product standards. DTR will be produced. Also Fraunhofer
confirmed, that measuring method and definition of warpage is very important
issue. To be followed up with Korea.
– Accelerated reliability test of microvia: Will be reconsidered to be
applicable as a screening test. TR is under preparation and draft will be
issued by end of May.