[‘21.04.22 seminar] Semiconductor technology seminar

1. Date : 2021 April 22 pm 1:00 ~ 5:00

2. Venue : COEX Conference Room 308

3. Schedule
1:00 – 1:10 / Greetings and introduction / Kim Hyun-ho, Chairman of KPIA

1:10 – 2:00 / Various Fan out Packaging Solution / Seongjin Park, Manager, ASM Pacific Technology

2:10 – 3:00 / Trends of research on the growth of intermetallic compounds in solder joints and mechanical reliability / Prof. Yoon-cheol Son, Chosun University

3:10 – 4:00 / Advances in Package Substrates Manufactured by Reel to Reel Processes /

Jeongsu Byun, Executive Vice President, Haesung DS

4:10 – 5:00 / Built-in Stress effects of IC package substrate’s layers on its warpage /

Min-Sung Kim, Vice President, Daedeok Electronics