[‘20.11.5] Symposium Packaging Integration

1. Date : 2020 November 5 pm 1:00 ~ 4:50

2. Venue : The-K hotel Gyeongju

3. Schedule
1:00 – 1:10 / Introduction of semiconductor fusion component mounting technology and standard activities / Kim Hyun-ho, KPIA

1:10 – 1:20 / Introduction of the Semiconductor Convergence Parts Mounting Technology Center / Team Leader Ki-Baek Hong, Chungbuk Techno Park

1:20 – 1:30 / Introduction of the PCB Industry Innovation Center / Lim Young-min, Chief Executive Officer, KETI

1:30 – 2:10 / (1-x)Ba(Sn,Ti)O3 -x(Ba,Ca)TiO3 Tc control through the structure and stress of material and energy harvesters/ Professor Joonghyuk Ko, Chung-Ang University

2:10 – 2:50 / Growth of compound semiconductors and application of devices / Professor Ho-kyung Kim, Seoul National University of Science and Technology

2:50 – 3:30 / Research on artificial intelligence memory using solution process technology / Professor Seongjin Kim, Chungbuk National University

3;30 – 4:10 / Fabrication and evaluation of MoO3 doped In2O3 TFT and application to NMOS inverter / Researcher Gwan-Jun Heo, SK hynix

4:10- 4:50 / Fabrication and Evaluation of Neuromorphic Synaptic Transistors Using HfO2 Ferroelectric Thin Film / Professor Sungmin Yoon, Kyunghee University