<Advanced electronic packaging technology and market seminar>

1. Date and time: February 22, 2024 (Thursday) 10:00 ~ 17:00

2. Venue: Suwon Convention 101+102

3. Schedule:

10:00 – 10:50 / Changes, Challenges, and Opportunities in the PCB Market / Zoey Wang, Prismark

11:00 – 11:50 / The copper foil for high-speed application / Michael Gay, isola

13:00 – 13:40 / Semiconductor industry market trends and outlook / Center Director Noh Geun-chang, Hyundai Motor Securities

13:50 – 14:30 / Smart SMT mounting solution based on AI technology / Professor Seungbae Park, BINGHAMTON University

14:40 – 15:20 / Development status and evaluation technology of substrate materials for high-speed communication / Senior Park Seong-dae, KETI

15:30 – 16:10 / Advanced copper wiring process for application of advanced semiconductor packaging / Professor Bongyoung Yoo, Hanyang University

16:20 – 17:00 / Chiplet packaging technology trends for growing generative AI models / Nishio Toshihiko, SBR Technology