[News] Standard proposed by KPIA will be an international standard for Packaging Integration industry

The "Design Guidelines for Cavity Substrates" proposed by Kim Hyun-ho, chairman of KPIA, Korea Packaging Integration Association, is underway and is about to be international standard. 

In addition, Korea has emerged as a leading country in the technology by preparing an international standard proposal for Laser Assisted Bonding (LAB), one of the next-generation semiconductor packaging electronic mounting technologies

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