[KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar II

1. Date: April 14, 2023 (Fri) 10:00 am - 17:00 am

2. Venue: COEX 300

3. Schedule:

10:00 – 10:50 / Recent market and technology trends of Hi-speed PCB and materials / Zoey Wang, PRISMARK

11:00 – 11:45 / Trend of low-dielectric resin for high-speed communication / Nam Dong-gi, Director of Research Center, Polaris Uno

1:00 – 1:35 / PCB material, high heat-resistance resin trend / Hyeong-wook Choi, Director of Research, Nanokor

1:35 – 2:10 / Latest solder technology trends / Sungkyun Sung, Director, macedermid

2:25 – 3:00 / Immersion Tin Finish treatment for electrical products / Jinho Lee, Commissioner, KETI

3:00 – 3:35 / SiP Failure location Analysis with Advantest's TS9001 TDR / Shinohara Makoto, Advantest Japan

3:50 – 4:25 / APT & Power device Packaging Process Issues and Solutions / Seongjin Park, Director, ASMPT

4:30 – 5:00 / Advanced packaging market and technology / Gabriela PEREIRA, Yole Development