[KPIA Spring Seminar] Electronics Packaging Integration Technology Seminar I]

1. Date: Wednesday, April 12, 2023 10:00 am - 17:00 am

2. Venue: COEX 307AB

3. Schedule:

10:00 – 10:40 / Advanced PKG’s future and market prospects / Byung-Yeon Cho, Senior Vice President, Samsung Electronics

10:40 – 11:15 / Power Semiconductor Packaging Technology Trend / Byungjin Kim, General Manager, OnSemi Korea

11:25 – 12:00 / Double-sided heat dissipation module package using 3D clip bonding technology / Choi Yun-hwa, CEO, GMJECO

1:15 – 1:50 / R&D direction for sustainable battery industry development / PD Jung-Doo Lee, KEIT

1:50 – 2:25 / Sulfide-based all-solid-state battery development trends and issues / Chief Oh-min Kwon, Pohang Institute of Industrial Science and Technology

2:40 – 3:15 / Upcycle technology development trend of EV batteries / Seongjin Choi, CEO, POEN

3:15 – 3:50 / Global Secondary Battery Testing and Certification Trends / Beomjong Kim, Center Director, KTL

4:00 – 4:45 / Embedding Technology for Power Electronics / Andres Ostmann, Fraunhofer IZM