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NEWSLETTER _VOL.6 (2021.08.25)

관리자 2021-09-13 Number of views 216

NEWS LETTER 

Vol.6 (21.08.25)

 

반도체실장기술센터 


-반도체융합부품 실장기술 지원

-시제품제작 & 패키지 공정 장비 구축 

-신뢰성시험 &성능평가 장비 구축
 

문의.
홍경진 대리 T. (043)270-2312 E. kjhong@cbtp.or.kr

Activities

Implementation technology expert 

exchange meeting


- Contents of standard development cooperation 

project and outline of implementation

- 5G base station antenna technology development 

trend

- Satellite reception electronic phased array antenna 

technology for mobile devices

- Contents of standard development cooperation 

project and outline of implementation

Electronic mounting technology 

standard seminar - Online


- Status of response to overseas technology 

regulations

- Mounting technology and IEC TC91 standard trend

- Semiconductor technology and IEC TC47 standard 

trend

- Display technology and IEC TC110 standard trend

- Trends in printed electronics and IEC TC119 

standards

Electronic mounting technology IEC TC91 

expert committee 


- Development of unique standards

- New unique standard technology

- Review of 6 types of national standard establishment

- Contents of revision 2 of national standards and 

revision plan

- 2 national abolition standards

- Electronic mounting technology standard 

management roadmap

Semiconductor fusion component mounting 

technology symposium


- Solder joint intermetallic compound growth behavior and mechanical reliability Research Trends

- Quality status of domestic electronic products 

through defect analysis

- Vacuum deposition technology for latent fingerprints

- Artificial intelligence integrated memory system 

using brain function simulation

- Reusable battery industry and test and certification 

status

Semiconductor fusion component mounting 

technology seminar


- Various Fan out Packaging Solution 

Advances in Package Substrates Manufactured
  by Reel to Reel Processes 
- Recent Trend of Electronics Packaging and PCB
  Industry

- Package substrate technology trends and challenges

- Semiconductor high-density packaging technology 

trend

Material parts development business 

KICK-OFF workshop


- Announcement by the general organization

- Announcement of the project implementation plan 

by the Ministry of Science and Technology

- Announcement of the project execution plan by the Ministry of Industry

- Announcement of project execution plan by the 

Ministry of SMEs and Startups

- Discussion of cooperation plan at sub-division 

technical exchange meeting

NOTICE

<Packaging Integration Symposium>

Special Session Organizer : 한국실장산업협회

세계적 규모의 ICAE2021 국제학술대회 및
실장기술 특별심포지엄에 많은 관심 바랍니다.

일시 2021년 11월 9일(화)~11월 12일(금)

장소 라마다 플라자 제주호텔