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NEWSLETTER _VOL.5 (2021.03.30)

관리자 2021-09-13 Number of views 199
NEWS LETTER

 VOL.5 (21.03.30)

main news

1. Chungbuk Semiconductor Industry 

Promotion Council inauguration ceremony

Establishment of the Chungbuk Semiconductor Industry Promotion Council to lead the sustainable growth of the Chungbuk semiconductor industry
(Presentation: KPIA)
- Date: November 19, 2020
- Venue: Grand Plaza Cheongju Hotel
- Attendees: Governor Lee Si-jong, President of Chungbuk TP, about 40 semiconductor companies including Samsung Electronics, 
SK Hynix, and Nepes
자세히 보기 > 

2. IEC TC91 Expert Committee (Online)

- Outline of five drafts of proprietary standards development
- Results of 4 types of national standard establishment review
- Results of review of 7 revisions of national standards
- Results of review of 2 types of abolition of national standards
- IEC TC International Conference Report
자세히 보기 > 

3. Embedding technology 2021 (Online)

- Latest development status of EOMINTM            wiring board with embedded componet
- Embedded Structure for PCB Thermal Solution    in High-Speed Optical Module
- Development of Device Embedded Module  

자세히 보기 > 

4. LCG 국제실장기술 회의(Online)

- Temperature cycling test method and reliability
  performance index for die attach materials        applied to discrete type power electrocix            devices
- power cycling test method and reliability          performance index for die attach materials        (near chip interconnection) applied to

 discrete type power electronic devices 

자세히 보기 > 

5. Technical exchange cooperation meeting of the Society of Electrical and Electronic 

Materials

- Technical exchange business cooperation meeting with the Korean Society of Electrical and Electronic Materials
- Consultation with the technical subcommittee for the summer and ICAE 2021 international symposium
- Business cooperation plan with semiconductor convergence mounting technology industry
자세히 보기 > 

6. Semiconductor fusion parts R&D project 

planning meeting

- Semiconductor fusion parts technology issues
- Plan to utilize the semiconductor mounting technology center
- Discovery of mounting technology items and project planning
자세히 보기 > 

7. 2021 2nd Technical Council (Hybrid)

-TC51 (Magnetic part ferrite material) National standard Class 1
-TC68 (magnetic alloy magnetic steel) national standard 3 types
-TC91 (electronic mounting technology) 4 national standards
-TC110 (display) national standard 3 types
자세히 보기 > 

8. MOU

Business cooperation for the development of 

semiconductor convergence industry


- Signed MOU with Lead K-Fairs (21.01.07)

   - Signed MOU with Hansol Semiconductor 

(21.02.01)

   - Signed MOU with Sungjin Tech (21.03.04)

9. Semiconductor industry news releases

- Global DRAM performance in Q4 2020
- Top 10 wafer processing capacity by world size in 2020
- Shipments of connected TV devices in the 4th quarter of 2020
- World smartphone production in the first quarter of 2021
- Third-generation semiconductor market in 2021
- etc
자세히 보기 > 
한국실장산업협회 회원 안내 
 


<World IT Show> 전시회
출전사 : 한국실장산업협회
차세대 첨단 산업을 주도하는 대표 전시회인 월드IT쇼
및 실장기술세미나에 많은 등록 바랍니다.
 
일시 2021년 4월 21일(수)~4월 23일(금)
 
장소 코엑스 HAll AC124 (한국실장산업협회 전시부스)

2021 한국전기전자재료학회 하계학술대회
KIEEME Annual Summer Conference 2021
<반도체융합부품 실장기술 심포지엄> 개최
Special Session Organizer : 한국실장산업협회
역사와 권위의 KIEEME 하계학회 및 실장세미나에
많은 등록 바랍니다.
 
일시 2021년6월30일(수)~7월2일(금)
 
장소 강원도 평창 알펜시아리조트
 
논문초록 제출 마감 2021년 5월 7일(금)
 
사전등록 마감 2021년 5월 28일(금)

기기전시 신청 마감 2021년 6월 4일(금)

자세히 보기 > 

<Advanced Packaging Integration
Technology Symposium> 개최
Special Session Organizer : 한국실장산업협회
세계적 규모의 ICAE2021 국제학술대회 및
실장기술 심포지엄에 많은 논문제출 바랍니다.
 
일시 2021년 11월 9일(화)~11월 12일

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NEWSLETTER _VOL.6 (2021.08.25)
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NEWSLETTER _VOL.4 (2020.11.16)