1. Semiconductor convergence device packaging integration technology seminar

- Advanced Packaging technology and market
- Advanced Packaging Technology for Data Era
-LAB for micro LED transfer bonding process

(Laser-Assisted Bonding) and functional material 

technology

- The role of 5G core parts and the value chain

- Electrical reliability of semiconductor and 

package wiring and Interface reliability 

improvement technology

2. Packaging integration technology symposium

- (1-x)Ba(Sn,Ti)O3 -x(Ba,Ca)TiO3 material structure and Tc control through stress and energy 

harvesters

- Compound semiconductor growth and device 

application

- Research on artificial intelligence memory using solution process technology

- Fabrication and evaluation of In2O3 TFT doped with MoO3 Application to NMOS inverter

- Neuromorphic applied with HfO2-based 

ferroelectric thin film Fabrication and evaluation 

of synaptic transistors

3. Electronic packaging integration technology standard seminar

- Status of standardization activities in the 

electrical and electronic field

- Mounting technology and IEC TC91 standard 

trend

- Semiconductor technology and IEC TC47 

standard trend

- Trends in printed electronics and IEC TC119 

standards trend

- Display technology and IEC TC110 standard 

trend

4. Artificial Intelligence (AI) Semiconductor 

Technology and Market Seminar

- AI Semiconductor technology and market
- Artificial neural synapses based on
amorphous oxide semiconductor
-COMOS-new device FEOL simultaneous 

integration platform development

- Electronic synapse and neuron for low-power 

neuromorphic hardware

- Solution-processed multi-stack neuromorphic 

memory

5. IEC TC91 expert committee meeting

- 32 types of confirmed standard final results

- Introduction of an overview of proprietary 

standards and conforming standards

- National standard revision work and abolition 

review proposal

- IEC TC91 International Conference Schedule and Major Agenda

- 2020 IEC TC91 WG and General Assembly 

Schedule

6. Intelligent semiconductor mounting 

technology conference

- Implementation of intelligent semiconductor to 

discover future growth engines, etc.Technology 

R&D planning

- Linkage with regional innovation systems 

(universities, public institutions, companies, etc.)

Promotion plan

7. Invitational presentation

1. IMPACT-EMAP 2020 Conference(Taiwan)

- October 23, 2020
- The concept of 3D Fan-Out Device embedded
  Module(FODEM)
 

2. Smart Navy Conference (Naval Academy)

- November 13, 2020

- State-of-the-art mounting technology trends

3. System semiconductor PnT industry fostering 

forum (Chungcheongbuk-do)

- November 19, 2020 (planned)

- System semiconductor PnT necessity and 

development plan