Intelligent semiconductor packaging integration technology conference

- AI memory semiconductor preparing for the post-

corona era Technology Status

- Consultation on the formation of AI intelligent memory semiconductor industry consortium

- Realization of artificial intelligence automation technology of the 4th industrial revolution and mounting technology

Semi-conductor packaging integration technology development meeting

Meeting of standard experts

- Report on the results of the implementation of the project goals of standard development cooperation organizations in the first half of the year

- Table of contents and content discussion for TC91 activity report

- Review and main contents of 11 cases of TC91

international standard

- Electronic mounting technology IEC TC91 Lee Min-

soo appointed as expert chairperson

- Appointed as Chairman Youngmin Lim of the 

Electronic Mounting Technology Association

 JDA 

For FOPLP and 3D embedding product development

Facility joint development

- Signed JDA with Simmtech Co., Ltd. and 

CoMS Co., Ltd. (20.08.21)

MOU 

Business cooperation for the development of 

semiconductor convergence industry

- Signed MOU with 'Now Tech' (20.08.03)

- Signed MOU with 'MicroInspection' (20.08.25)

- Signed MOU with 'Korea Electrical and Electronic 

Materials Science' (20.09.01)

- 'MOU signed with Sanico Electronics (20.09.03)