Ministry of Trade, Industry and Energy National Institute of Technology and 

Standards Designation of secretariat

(IEC TC91)

Designated as a secretariat for international standards in the field of electronic mounting technology (IEC TC91) by the Korea Mounting Industry Association ('20.6.25)

National Institute of Technology and 

Standards Technical Committee

Korean name change

(Electronic assembly technology->

전자실장기술)

The actual discussion and enactment in IEC TC91 (Electronic Assembly Technology) is the design, material, board, module, packaging, process, test, etc. of electronic devices, and the name is changed to [Electronic Assembly Technology]

IEC TC91 expert committee

Meeting of the expert committee in the field of 

electronic mounting technology ('20.7.24)

  - KS confirmation standard expert opinion in the field of mounting

- Progress of international standard documents by implementation WG

- The proposal for the 2021 International Standards Conference in Korea

Semiconductor convergence device 

packaging technology symposium

- Package substrate technology trend related to 

mounting technology

- Organic semiconductor-based fusion/composite 

flexible device technology

- Technology trends and applications of oxide 

semiconductors

- Electroless Ni-P surface treatment and mounting technology trends

- Mounting Technology Support Center & PCB 

Industry Innovation Center

Packaging integration exchange meeting

- Organic thin film coating process technology 

('20.6.18)

- 4th industrial revolution and next-generation 

semiconductor memory

- Transparent flexible electrode organic electronic device ('20.7.16)

- Electroless Ni-P surface treatment mounting 

technology

MOU 

Business cooperation for the development of 

semiconductor convergence industry

- Signed MOU with 'i-Best' ('20.7.27)

- Signed MOU with 'Fine Deer Chip' ('20.7.29)