FOWLP is the fastest-growing packaging platform, adopted for various applications from mobile and automotive to medical and packaging, for both low-end (i.e. audio codecs) and high-end devices (i.e. APU).

– More (click)

https://www.i-micronews.com/adv-packaging/11739-fan-out-panel-level-packaging-nepes-vision-interviewed-by-yole-developpement.html/

[Source : www.i-micronews.com]