GENERAL INFORMATION

Meeting of JIC Conference

Busan Korea, 25 October 2018

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MEETING VENUE

THE BAY 101, 52 Dongbaek-ro, Haeundae-gu, Busan,Korea

MEETING ROOM: Marine Hall

(Located on B1, Marine Hall of THE BAY 101)

Host contacts:

Ms. KH LEE

Email: jissokorea@gmail.com

Phone: +(82) 10-7271-7620

The JIC conference room is located on B1, Marine Hall of THE BAY 101.

9:00-9:10 Welcome to JIC 17 / Masahide Okamoto (Chair: TC91 LCG)

9:10-9:20 Welcome greeting / Hyunho Kim(JKC)

9:20-10:20: JISSO Activities

<1> 09:20-09:35 JISSO activities in Europe / Walter Huck (Murata)

<2> 09:35-09:50 JISSO activities in Japan / Ryoji Ninomiya (Toshiba)

<3> 09:50-10:05 JISSO activities in North America / Douglas Sober(Essex Technologies Group Inc.)

<4> 10:05-10:20 JISSO activities in Korea / Hyunho Kim(JKC)

10:45-12:00:TC91 and Liaison TCongoing projects

<5> 10:45-11:00 The future of whisker testing / Udo Welzel (Bosch)

<6> 11:00-11:15 Whisker data related issue (Reliability conditions) / Ichizo Sakamoto (Omron)

<7> 11:15-11:30 JWG9 projects(“TC91 and TC86”) / Youngmin Im (KETI)

<8> 11:30-11:45 Device Embedded Module (METI national PJ in Japan) / Hisao Kasuga(IS-INOTEK)

<9>11:45-12:00 Wearable Electronic -Standards for e-textiles / Chris Joergensen (IPC)

13:30-15:35: JISSO Technology (I)

<10> 13:30-13:55 Power Device Assembly in Europe / Udo Welzel (Bosch)

<11> 13:55-14:20 Korea PCB Industry 2018 / Minsu Lee(KPCA)

<12> 14:20-14:45 Current technical challenges in package warpage measurement during SMD and the need of insitu warpage measurement / Byounghun Moon(Micron Korea)

<13> 14:45-15:10 IoT/SiP/Module(New Packages) Test Solutions / Jeonghwan Koo (Advantest Korea)

<14> 15:10-15:35 Embedded Component Package Technology Trend / Homin Yang (AT&S)

16:00-18:05: JISSO Technology (II)

<15> 16:00-16:25 Advanced Package Test Solution / Michio Kaida (Nidec-read)

<16> 16:25-16:50 New Applications of High Modulus RCC for the Semiconductor Package Substrate / Sangsuk Cha(Simmtech)

<17> 16:50-17:15 Various Bonding process for FO technology in WLP and PLP Fan Chun Ho, Nelson (ASM)

<18> 17:15-17:40 Performance of Fan-out Package and Its Applications / Sangyong Park(NEPES)

<19> 17:40-18:05 Trends of Fan-out Panel Level Packaging / T. Braun (Fraunhofer IZM)

18:05-18:15:Wrap and Closing

Wrap and Closing / Udo Welzel (Bosch)